Standard Technology	Leading Edge Technology	Emerging Technology
Layers	20	32	>32
Aspect Ratio	12:1	14:1	>14:1
Blind & Buried vias	yes	yes	yes
Controlled depth	yes	yes	yes
Conductive hole fill	yes	yes	yes
Finished Plated Holes
Smallest Drilled	.006"	.005"	.004"
Smallest Buried Via	.005"	.004"	laser
Trace Widths
Finished trace width (Minimum) outer layer	.004"	.003"	.002"
Finished Spacing (Minimum) outer layer	.004"	.003"	.002"
Trace width (minimum) inner layer	.004"	.003"	.002"
Spacing (minimum) inner layer	.004"	.003"	.002"
Electrical Test
Minimum Pad Pitch	.007"	.005"	<.005"
Minimum Pad Size	.003"	.002"	.002"
Voltage Range	0.5-1000VDC	0.5-1000VDC	0.5-1000VDC
Continuity, Test Field	18" X 25"	18"X25"	18"X25"
Controlled Impedance	strip and differential =/-10%	strip and differential +/- 5%	strip and differential +/- 5%
Isolation Range	10-500 Mohms	10-500 Mohms	10-500 Mohms
Resistance Range	10-500 Mohms	10-500 Mohms	10-500 Mohms
Surface Finishes
Gold Plate (Hard)	Yes	Yes	Yes
Gold Plate (Soft)	Yes	Yes	Yes
Electroless nickel/ immersion gold	Yes	Yes	Yes
Immersion Silver	Yes	Yes	Yes
White tin	Yes	Yes	Yes
OSP	Yes	Yes	Yes
HASL	Yes	Yes	Yes
Reflow	Yes	Yes	Yes
SIPAD	Yes	Yes	Yes
Matte tin	Yes	Yes	Yes
Electroplated Nickel	Yes	Yes	Yes
Materials
FR-4	Yes	Yes	Yes
Polyimide	Yes	Yes	Yes
Flex (Dupont Kapton AP & LF)	Yes	Yes	Yes
Rogers 3000, 4000, and	Yes	Yes	Yes
Speed Board	Yes	Yes	Yes
Teflon	Yes	Yes	Yes
Ceramic	Yes	Yes	Yes
Copper Weights
Minimum	1/4oz.	<1/4oz.	40 Angstrom
Maximum	4oz.	10oz.	>10oz.
Soldermask
Min. Dam (Dry Film)	.004"	.004"	LDI
Min. Dam (LPI)	.002"	.002"	LDI