We're pleased to announce that we've recently licensed the coveted SIPAD technology from SIPAD Systems, Inc. Our agreement makes us one of a limited number shops in the United States with this unique capability.
SIPAD is the original solid solder deposit (ssd) technique developed by Siemens AG. It's an affordable and practical solution to surface mount component attachment, because it eliminates the application of solder paste by the assembler. SIPAD boards have the solder paste already applied to the smt pads in a solid, flattened state. The ssd's are then coated with an adhesive no-clean flux, dried to a tacky finish, and covered with a protective paper awaiting assembly.
When ready to assemble, the paper is removed, exposing the tacky flux finish. The components are either hand placed or auto placed onto the ssd pads. Leads can be slid into place without disturbing the solid solder deposit. The assembly is reflowed (heated), causing the ssd pads to flow into a meniscus, attaching the component leads with predictable and perfect results.
The advantages of this process are many:
- Eliminates the paste printing process, which is time consuming and generates the majority of the scrap for assembly operations.
- Replaces that step with a predictable and more forgiving method to attach surface mount components.
- Adds shelf life to products ready to be assembled; conventional liquid paste dries out.
- Adds flexibility to the workload. Boards can be pulled and assembled during short periods of down time.
- Improves throughput. Paste printing and subsequent paste inspection takes time.
- Reduces (and usually eliminates) rework.
- Eliminates the need for cleaning of the final assembly.
- Lead free, eutectic, and low or high temp solder paste is available.
- Prototype quantities can be hand assembled with existing equipment with 100% results.
- Allows hand placement of .4mm leaded QFP and TSOP style components.
- 0603 and 0402 components can be hand placed and soldered with perfect results.
- Allows hand placement of BGA LLP and other leadless packages, with no shorts, opens, cleaning, or voids.
- Keeps previously subcontracted work in house.
